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材料及部件

豁免范圍及期限

基于ELV指令4(2)章, (b)(iv)點(diǎn)需要加貼標(biāo)簽或標(biāo)識

2(c)(i). Aluminium alloys for machining purposes with a lead content up to 0,4 % by weight

2(c)(i) 含鉛0.4%（重量比）的鋁合金

Vehicles type approved before 1 January 2028 and spare parts for these vehicles

2028年1月1日前批準(zhǔn)的汽車類型及相關(guān)零配件

3. Copper alloy containing up to 4 % lead by weight

3. 含鉛4%（重量比）的銅合金

(3)

5(b)(i). Lead in batteries used in 12 V applications

5(b)(i).用于12V的電池中的鉛

Vehicles and spare parts for these vehicles (3)

這類型汽車及其零配件

X

5(b)(ii). Lead in batteries for battery applications not included in entry 5(a) and entry 5(b)(i)

5(b)(ii).  5(a)和5(b)(i)不包含的電池中的鉛

Vehicles  type approved before 1 January 2024 and spare parts for these vehicles

2024年1月1日批準(zhǔn)的汽車類別及相應(yīng)的零配件

X

8(g)(ii)Lead in solders to complete a viable electrical connection between the semiconductor die and the carrier within integrated circuit flip chip packages where that electrical connection consists of any of the following:

(i) a semiconductor technology node of 90 nm or larger;

(ii) a single die of 300 mm2 or larger in any semiconductor technology node;

(iii) stacked die packages with dies of 300 mm2 or larger, or silicon interposers of 300 mm2 or larger.

8(g)(ii)用于在集成電路倒裝芯片封裝中的半導(dǎo)體晶體和載體之間完成可行的電連接的焊料中的鉛，其中該電連接包括以下任何一種:

(i)90納米或更大的半導(dǎo)體技術(shù)節(jié)點(diǎn)；

(ii)任何半導(dǎo)體技術(shù)節(jié)點(diǎn)中300 mm2或更大的單個晶體；

(iii)300mm2以上模具或300mm2以上硅插片的堆疊模

(1)

X