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《DFMA面向制造與裝配的設(shè)計》英文版 第5-6部分（76頁）

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  《DFMA面向制造與裝配的設(shè)計》英文版 第5-6部分（76頁）

  在產(chǎn)品設(shè)計階段，充分考慮來自于產(chǎn)品制造和裝配的要求，使得機械工程師設(shè)計的產(chǎn)品具有很好的可制造性和可裝配性，從根本上避免在產(chǎn)品開發(fā)后期出現(xiàn)的制造和裝配質(zhì)量問題。

  本附件包含以下內(nèi)容：

  Product Design for Manufacture and Assembly（Third Edition）

  5. Design for High-Speed Automatic Assembly and Robot Assembly........................ 185

  5.1 Introduction..... 185

  5.2 Design of Parts for High-Speed Feeding and Orienting............ 186

  5.3 Example........... 189

  5.4 Additional Feeding Difficulties......................... 193

  5.5 High-Speed Automatic Insertion....................... 193

  5.6 Example........... 197

  5.7 Analysis of an Assembly........... 198

  5.8 General Rules for Product Design for Automation..................... 198

  5.9 Design of Parts for Feeding and Orienting......203

  5.10 Summary of Design Rules for High-Speed Automatic Assembly......................206

  5.10.1 Rules for Product Design.......................206

  5.10.2 Rules for the Design of Parts.................206

  5.11 Product Design for Robot Assembly.................206

  5.11.1 Summary of Design Rules for Robot Assembly............. 212

  References.................. 218

  6. Printed Circuit Board Design for Manufacture and Assembly....... 219

  6.1 Introduction..... 219

  6.2 Design Sequence for Printed Circuit Boards.... 219

  6.3 Types of Printed Circuit Boards.........................220

  6.3.1 Number of Sides............220

  6.3.2 Number of Layers......... 221

  6.3.3 Board Materials............. 221

  6.3.4 Device Types..................222

  6.3.5 Copper Weight..............222

  6.4 Bare Board Manufacture...........222

  6.4.1 Basic Bare Board Costs...........................223

  6.4.2 Number of Boards per Panel.................225

  6.4.3 Hole Drilling..................226

  6.4.4 Optional Bare Board Processes.............226

  6.4.5 Bare Board Testing........227

  6.5 Terminology.....227

  6.6 Assembly of Printed Circuit Boards.................228

  6.6.1 Assembly Operations for Through-Hole Printed Circuit Boards..........229

  6.6.1.1 Automatic Dual Inline Package Insertion.......230

  6.6.1.2 Automatic Axial (VCD) Insertion..................... 232

  6.6.1.3 Automatic Single Inline Package Insertion.....234

  6.6.1.4 Automatic Radial Component Insertion..........234

  6.6.1.5 Semiautomatic Insertion........235

  6.6.1.6 Manual Insertion.....................235

  6.6.1.7 Robot Insertion........................236

  6.6.1.8 Inspection and Rework...........236

  6.6.2 Assembly of Surface-Mounted Devices....236

  6.6.3 Soldering Processes......238

  6.6.3.1 Wave Soldering........................238

  6.6.3.2 Reflow Soldering.....................238

  6.6.4 Other Assembly Processes.................... 239

  6.6.4.1 Cleaning.......... 239

  6.6.4.2 Rework............ 239

  6.6.4.3 Board Testing........................... 240

  6.6.5 Assembly Sequences for Printed Circuit Boards........... 240

  6.7 Estimation of PCB Assembly Costs................... 242

  6.7.1 Component Insertion Costs................... 243

  6.7.1.1 Insertion Cost........................... 244

  6.7.1.2 Setup Cost...... 246

  6.7.1.3 Rework Cost............................. 247

  6.7.1.4 Programming Cost.................. 247

  6.7.2 Worksheet for Printed Circuit Board Assembly Costs............................ 248

  6.7.3 Example.... 248

  6.8 Case Studies in PCB Assembly..........................250

  6.8.1 Measuring Instrument Connector Board........................250

  6.8.2 Power Supply.................254

  6.9 Glossary of Terms......................256

   

  References..................260

• 資料大小：
  4721.93KB
• 所屬類別：
  科研開發(fā)
• 更新日期：
  2020-01-02
• 適用行業(yè)：
  電子電氣；機械設(shè)備與裝置；特種設(shè)備；機動車；醫(yī)療器械；計量與測量
• 上傳人：
  NJKY
• 標(biāo) 簽：

  DFMA 面向制造與裝配的設(shè)計

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